Termékek azaz 4034 (3)

The AX99100 is a single chip solution that fully integrates PCIe 2.0 Gen 1 endpoint controller and SerDes with a variety of peripherals such as four High Speed Serial Ports, one Parallel Port, I²C Master, High Speed SPI, Local Bus (ISALike) , and GPIOs. It consists of four main configurations such as 4S (PCIe to Quad Serial), 2S+1P (PCIe to Dual Serial and Single Parallel), 2S+SPI (PCIe to Dual Serial and SPI), and LB (PCIe to Local Bus/ISALike) for different kinds of applications. The AX99100, in 68pin QFN, are available with RoHS compliant package and supports commercial grade operating temperature range from 0 to 70°C and industrial grade from 40 to 85°C. PCI Express Singlelane (X1) PCI Express Endpoint Controller with PHY integrated Compliant with PCI Express 2.0 Gen

Microcontrôleur à puce unique avec TCP/IP et 10/100M Fast Ethernet MAC/PHY (Caractéristiques 512K Flash, EMI, Local Bus, MII, 32GPIOs, LQFP128)The AX11015, Single Chip Microcontroller with TCP/IP and 10/100M Fast Ethernet MAC/PHY, is a SystemonChip (SoC) solution which offers a high performance embedded micro controller and rich communication peripherals for wide varieties of application which need access to the LAN or Internet. With builtin network protocol stack, the AX11015 provides very cost effective networking solution to enable simple, easy and low cost Internet connection capability for many applications such as consumer electronics, networked home appliances, industrial equipments, security systems, remote data collection equipments, remote control, remote monitoring and remote management. In addition to standalone application, the AX11015

BG96 est une série de LTE Cat.M1/Cat.NB1/EGPRS+ GNSS BG96 is a series of LTE Cat.M1/Cat.NB1/EGPRS module offering a maximum data rate of 375kbps downlink and uplink. It features ultra-low power consumption, and provides pin-to-pin compatibility with Quectel LTE module EG91/EG95, Cat.NB1 (NB-IoT) module BC95, UMTS/HSPA module UG95/UG96 and GSM/GPRS module M95. With a cost-effective SMT form factor of 22.5mm × 26.5mm × 2.3mm and high integration level, BG96 enables integrators and developers to easily design their applications and take advantage from the module’s low power consumption and mechanical intensity. Its advanced LGA package allows fully automated manufacturing for high-volume applications. Fast time-to-market:Reference designs, evaluation tools and timely technical support minimize design-in time